ISSP2019: The 15th International Symposium on Sputtering and Plasma Processes

ISSP2019: Outline

International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was “Reactive Sputtering”. It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.

This symposium has two characteristics. One is that the program committee is formed mainly by members from related industries. Hence, the general tendency of papers presented in the symposium is practical use of the sputtering technology and industrial relevancy. The other is that all the oral speakers including invited talks are requested to present again of their presentation at the poster session. This system is giving unique opportunities for attendees to discuss details of the oral presentations with speakers.

We hope that every engineer and researcher in the world who is interested in sputtering and plasma processes attends this exciting symposium. We look forward to seeing you in Kanazawa.

Location and Date

Important Deadlines

  • Abstract Submission has been closed
  • Manuscripts for On-site proceedings: April 19, 2019
  • Registration via website is May 31st

Symposium Details

Subject Areas

  1. Fundamentals of Sputtering and Plasma Processes
  2. Sputtering Processes
  3. Plasma Processes
  4. Plasma Induced Process Technologies
  5. Thin Films
  6. Micro and Nano Technologies
  7. Applications
  8. Others



Presentation Styles

Invited Presentation (40 minute oral and poster)
Presentation A (20 minute oral and poster)
Presentation B (poster)

All oral presentations are also discussed in the poster session.

On-site Proceedings

Participants will receive one copy of the on-site proceedings at the symposium.

Post-symposium proceedings

Peer-reviewed papers after the symposium will be published in Journal of Vacuum Science & Technology B.

Registration fee

Regular Scientific Sessions (including one copy of the on-site proceeding)

  By May 17, 2019 After May 17, 2019
Research Division-Sputtering and Plasma(SP-bukai)Member   ¥35,000 ¥40,000
Member of Sponsoring Society ¥40,000 ¥45,000
Member of Assisting Society ¥47,000 ¥52,000
Students(Presenter) ¥20,000 ¥25,000
Others ¥50,000 ¥55,000
Accompanying Students(without presentation) ¥15,000 ¥20,000


Special Tutorial

  By May 17, 2019 After May 17, 2019
Regular (Attendee of Scientific Sessions) ¥5,000 Not available
Regular (Only tutorial) ¥20,000 Not available
Student ¥5,000 Not available

 ISSP2019 Registration site

          * Registration via web page has been closed.

             Please register at the venue.


ISSP Award

 "Best Poster Award"  will be given to the author(s) of the outstanding poster presentations. Oral papers will be judged on their poster presentations. The award ceremony will be held at the last day of the symposium (June 14).