ISSP2019: Outline
International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was “Reactive Sputtering”. It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.
This symposium has two characteristics. One is that the program committee is formed mainly by members from related industries. Hence, the general tendency of papers presented in the symposium is practical use of the sputtering technology and industrial relevancy. The other is that all the oral speakers including invited talks are requested to present again of their presentation at the poster session. This system is giving unique opportunities for attendees to discuss details of the oral presentations with speakers.
We hope that every engineer and researcher in the world who is interested in sputtering and plasma processes attends this exciting symposium. We look forward to seeing you in Kanazawa.
Location and Date
- Venue: Ohgigaoka Campus, Kanazawa Institute of Technology, Ishikawa, Japan
- Date: June 11-14, 2019
Important Deadlines
- Abstract Submission has been closed
- Manuscripts for On-site proceedings: April 19, 2019
- Registration via website is May 31st
Symposium Details
Subject Areas
- Fundamentals of Sputtering and Plasma Processes
- Sputtering Processes
- Plasma Processes
- Plasma Induced Process Technologies
- Thin Films
- Micro and Nano Technologies
- Applications
- Others
Language
English
Presentation Styles
| Invited Presentation | (40 minute oral and poster) |
| Presentation A | (20 minute oral and poster) |
| Presentation B | (poster) |
All oral presentations are also discussed in the poster session.
On-site Proceedings
Participants will receive one copy of the on-site proceedings at the symposium.
Post-symposium proceedings
Peer-reviewed papers after the symposium will be published in Journal of Vacuum Science & Technology B.
Registration fee
Regular Scientific Sessions (including one copy of the on-site proceeding)
| By May 17, 2019 | After May 17, 2019 | |
| Research Division-Sputtering and Plasma（SP-bukai）Member | ¥35,000 | ¥40,000 |
| Member of Sponsoring Society | ¥40,000 | ¥45,000 |
| Member of Assisting Society | ¥47,000 | ¥52,000 |
| Students（Presenter） | ¥20,000 | ¥25,000 |
| Others | ¥50,000 | ¥55,000 |
| Accompanying Students（without presentation） | ¥15,000 | ¥20,000 |
Special Tutorial
| By May 17, 2019 | After May 17, 2019 | |
| Regular (Attendee of Scientific Sessions) | ¥5,000 | Not available |
| Regular (Only tutorial) | ¥20,000 | Not available |
| Student | ¥5,000 | Not available |
* Registration via web page has been closed.
Please register at the venue.
ISSP Award
"Best Poster Award" will be given to the author(s) of the outstanding poster presentations. Oral papers will be judged on their poster presentations. The award ceremony will be held at the last day of the symposium (June 14).