ISSP2019: The 15th International Symposium on Sputtering and Plasma Processes

ISSP2019: Program

Tuesday 11, Special Tutorial

13:00 -18:00
Fundamental aspects of reactive magnetron sputtering, Prof. Dr. Diederik Depla, Ghent University, Belgium

Wednesday 12 Oral Session

Welcome Address

09:50
Tetsuya Goto, Chair, ISSP2019 Executive Committee, Tohoku University, Japan

Opening Session / Fundamentals of Sputtering and Plasma

10:00 KN-1
Plasma-target interactions in magnetron sputtering, André Anders*, Leibniz Institute of Surface Engineering (IOM), Germany (KEYNOTE)
10:40 FS1-1
Plasma and process modelling for PVD deposition onto moving 3D substrates, Andreas Pflug*, Fraunhofer Institute for Surface Engineering and Thin Films IST, Germany (invited)
11:20 FS1-2
Fast camera imaging and strip probe measurements of spokes in HiPIMS plasma, Jaroslav Hnilica*1), Peter Klein1), Marta Šlapanská1), James W. Bradley2), Petr Vašina1), 1) Department of Physical Electronics, Masaryk University, Czech Republic, 2) Department of Electrical Engineering and Electronics, University of Liverpool, UK
11:40 FS1-3
Investigation of rotating spokes in DC magnetron plasma using high-speed video camera over 1 million frames per second, Shintaro Yamazaki*1), Tetsuya Goto2), Manabu Suzuki1), Rihito Kuroda1), Shigetoshi Sugawa1,2), 1) School of Engineering, Tohoku University, Japan, 2) New Industry Creation Hatchery Center, Tohoku University, Japan
12:00 FS1-4
Substrate temperature reduction during rotatable magnetron sputter deposition by the use of magnetically guided anodes, Dermot Monaghan*, Victor Bellido-Gonzalez, Tomasso Sgrilli, Gencoa Ltd, UK

Lunch Break 12:20-13:20

 

Fundamentals of Sputtering and Plasma (cont'd)

13:20 FS1-5
Sputtering of biomaterials with large cluster ion beams, Jiro Matsuo*, Kyoto University, Japan (invited)
14:00 FS1-6
Different types of HiPIMS discharges: a comparative study via time-resolved particle imaging, Nikolay Britun1), Jaroslav Hnilica2), Matthieu Michiels1,3), Peter Klein2), Petr Vasina*2), Rony Snyders1,3), 1) Chimie des Interactions Plasma-Surface (ChIPS), CIRMAP, Université de Mons, Belgium, 2) Department of Physical Electronics, Masaryk University, Czech Republic, 3) Materia Nova Research Center, Belgium
14:20 FS1-7
Simulation of microparticle motion and contamination in plasma coating systems, Philipp Schulz*, Andreas Pflug, Hans-Ulrich Kricheldorf, Fraunhofer IST, Germany
14:40 FS1-8
Minimal multi-target helicon sputtering tool, Kazunori Takahashi*1), Taichi Saito1), Akira Ando1), Shiro Hara2,3), 1) Department of Electrical Engineering, Tohoku University, Japan, 2) National Institute of Advanced Industrial Science and Technology, Japan, 3) Minimal Fab Promoting Organization, Japan
15:00 FS1-9
Systematic characterization of negative-ion-containing microwave-excited plasmas by Langmuir probe measurement, Tetsuya Goto*, Shigetoshi Sugawa, Tohoku Universlty, Japan

Coffee Break 15:20-15:40

 

Sputtering Processes I

15:40 SP1-1
Low-temperature formation of high-mobility InGaZnOx thin film transistor by ICP-enhanced reactive plasma processes, Yuichi Setsuhara*1), Kosuke Takenaka1), Masashi Endo1), Tomoki Yoshitani1), Giichiro Uchida1), Akinori Ebe2), 1) Joining and Welding Research Institute, Osaka University, Japan, 2) EMD Corporation, Japan (invited)
16:20 SP1-2
Coating of large area substrates with the rotatable cathode array – implications on layer properties, Marcus Bender*1), Daniel Severin1), Jürgen Grillmayer2), Wen-Lin Lin2), Markus Hanika1), 1) Applied Materials GmbH & Co. KG, Germany, 2) Applied Materials Taiwan, Taiwan
16:40 SP1-3
Digitalization of industrial vacuum coating, Harald Hagenstroem*, Frank Benecke, Thomas Strietzel, VON ARDENNE GmbH, Germany

Wednesday 12 Poster Session 17:20-19:00

Sputtering Processes, POSTER I

SP1-4p
On the synthesis of VOX thin film by reactive magnetron sputtering, Ken Mita*1), Silmina Adzhani1), Adriano Panepinto2), Xavier Noirfalise3), Corentin Guyot4), Michel Voué4), Ming Yang1), Tetsuhide Shimizu1), Stephanos Konstantinidis2), 1) Division of Intelligent Mechanical Systems, Graduate School of System Design, Tokyo Metropolitan University, Japan, 2) Plasma-Surface Interaction Chemistry (ChIPS), Belgium, 3) Materia Nova R&D center, Belgium, 4) Physics of Materials and Optics (LPMO), University of Mons, Belgium
SP1-5p
Synthesis of boron carbon nitride films by reactive HiPIMS of B4C in Ar/N2 mixture, Naoto Hayakawa*1), Hidetoshi Komiya1), Yoshikazu Teranishi2), Ming Yang1), Tetsuhide Shimizu1), 1) Tokyo Metropolitan University, Japan, 2) Tokyo Metropolitan Industrial Technology Research Institute, Japan
SP1-6p
Impact of magnetic field configuration in HiPIMS discharge of W in Ar atmosphere, Yuta Yamamura*1), Yoshikazu Teranishi2), Hidetoshi Komiya1), Ming Yang1), Tetsuhide Shimizu1), 1) Tokyo metropolitan university, Japan, 2) Tokyo Metropolitan Industrial Technology Research Institute, Japan
SP1-7p
Pressure gradient sputtering technology (PGS:High vacuum sputtering), Ken Yonezawa*1), Hiroki Oota1), Jun-Seok Oh2), Kazunori Koga3), Tatsuyuki Nakatani4), Masafumi Ito5), Masaharu Shiratani 3), 1) Kenix Corporation, Japan, 2) Graduate School of Engineering, Osaka City University, Japan, 3) Graduate School of Information Science and Engineering, Kyushu University, Japan, 4) Research Institute of Technology, Okayama University of Science, Japan, 5) Department of Electrical and Electronic Engineering, Meijyo University, Japan

Plasma Processes, POSTER I

PP1-1p
Simulations of electron energy distribution functions in VHF capacitively coupled plasmas, Yoshinobu Kawai*, Weiting Chen, Li-Wen Su, Kiichiro Uchino, Kyushu University, Japan
PP1-2p
Development of a compact, frequency-tuned, and pulsed helicon plasma source for silicon etching, Kengo Hanaoka*1), Kazunori Takahashi1), Akira Ando1), Shiro Hara2,3), 1) Department of Electrical Engineering, Tohoku University, Japan, 2) National Institute of Advanced Industrial Science and Technology, Japan, 3) Minimal Fab Promoting Organization, Japan
PP1-3p
Effects of hot-filament electron emitter on ion-plated thin film, Nobuaki Arai*1), Kensei Kamata2), Helmut Takahiro Uchida2), Yoshihito Matsumura1), 1) Course of Applied Science, Graduate School of Engineering, Tokai University, Japan, 2) Course of Mechanical Engineering, Graduate School of Engineering, Tokai University, Japan

Thin Films, POSTER I

TF1-1p
Effects of nitrogen flow on the mechanical properties and bonding characteristics of Hf-N films, Yi-En Ke*1), Yung-I Chen2), 1) Undergraduate Program in Optoelectronics and Materials Technology, National Taiwan Ocean University, Taiwan, 2) Institute of Materials Engineering, National Taiwan Ocean University, Taiwan
TF1-2p
XPS analysis of DLC thin films and oxidized DLC thin films, Kenji Yamada*1), Toru Harigai2), Hirofumi Takikawa2), 1) National Institute of Technology, Ishikawa College, Japan, 2) Toyohashi University of Technology, Japan
TF1-3p
Measurement of residual stress in CrN films with stress gradient deposited on Al alloy substrate by AIP method, Kazuya Kusaka1), Kenta Shirasaka*2), Daisuke Yonekura1), Yuta Tanaka3), 1) Tokushima University, Japan, 2) Graduate student of Tokushima University, Japan, 3) IHI Corporation, Japan
TF1-4p
Nanostructure Si/SiO2 quantum wells by magnetron sputtering, Toshio Takeuchi*1), Yoshiji Horikoshi2), 1) National Institute of Technology, Sendai College, Japan, 2) School of Science and Engineering, Waseda University, Japan
TF1-5p
Properties of Zr–Si–N diffusion barrier for Cu interconnects, Li-Chun Chang*1), Yu-Zhe Zheng2), Yung-I Chen2), You-Peng Chen1), Zin-Jing Yang1), 1) Department of Materials Engineering, Ming Chi University of Technology, Taiwan, 2) Institute of Materials Engineering, National Taiwan Ocean University, Taiwan
TF1-6p
Fabrication of diamond-like carbon films using filtered pulse arc deposition with Si-contained graphite target, Toru Harigai*1), Takafumi Toya1), Yuya Sugie1), Tsuyoshi Tanimoto1), Yoshiyuki Suda1), Hirofumi Takikawa1), Masao Kamiya2), Shinsuke Kunitsugu3), Sataru Kaneko4), Makoto Taki5), 1) Toyohashi University of Technology, Japan, 2) Itoh Optical Industrial Co., Ltd., Japan, 3) Industrial Technology Center of Okayama Prefecture, Japan, 4) Kanagawa Institute of Industrial Science and Technology, Japan, 5) Onward Ceramic Coating Co., Ltd., Japan

Micro and Nano Technologies, POSTER

MN1-1p
Effect of plasma ignition on growth temperature decrease of single-walled carbon nanotubes in plasma-coupled thermal chemical vapor deposition system, Sung-Il Jo, Goo-Hwan Jeong, Kangwon National University, Korea
MN1-2p
Brush-like carbon nanotube filament formation induced by sputtering, Masatoshi Hiromura*, Soichiro Magata, Seiji Funaki, Hideki Sato, Graduate School of Engineering, Mie University, Japan
MN1-3p
A new technique for mechanically extracting a carbon nanotube bundle, Akihito Fukui*, Ko Bepuu, Takahiro Namazu, Aichi Institute of Technology, Japan
MN1-4p
Effect of material interface control on bending strength of Al/Ni-reactively-soldered Si joint, Kana Maekawa*1), Shunsuke Kanetsuki2), Daiki Goto1), Takahiro Namazu1), 1) Aichi Institute of Technology, Japan, 2) Kobelco Research Institute, Japan

Thursday 13 Oral Session

Sputtering Processes II

09:00 KN-2
Review of system design issues in highly ionized magnetron sputtering, Jung-Hoon Joo*, Kunsan National University, Korea (KEYNOTE)
09:40 SP2-1
Magnetic mirror type magnetron sputtering cathode for low gas pressure and low power density operations, Taisei Motomura*1), Tatsuo Tabaru1), Masato Uehara1), Tetsuya Okuyama2), 1) National Institute of Advanced Industrial Science and Technology (AIST), Japan, 2) National Institute of Technology, Kurume College, Japan
10:00 SP2-2
Study on the hydrophobicity of rare earth ceria oxide coating by RF magnetron sputter, Jhao-Yu Guo1), Song-Yu Chen*1), Li-Shun Chen1,2), Wen-Jen Lee3), Yu-Lin Kuo1), Yao-Ming Wang4), 1) Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taiwan, 2) Chen-I Vacuum Technology Enterprise, Taiwan, 3) Department of Applied Physics, National Pingtung University, Taiwan, 4) Industrial Upgrading Service Department, Metal Industries Research & Development Centre, Taiwan
10:20 SP2-3
(To be provided), Denis Shaw*, Advanced Energy Industries Inc., USA

Coffee Break 10:40-11:00

 
11:00 SP2-4
Multicomponent thin films by (reactive) magnetron sputtering, Diederik Depla*, Robin Dedoncker, Ghent University, Belgium (invited)
11:40 SP2-5
Advances in deposition of Ta-doped Mo-oxide thin films by DC sputtering from ceramic targets, E. Franzke, H. Koestenbauer, C. Linke, D. Lorenz, T. Scherer, J. Winkler*, Plansee SE, Business Unit Electronics, Austria
12:00 SP2-6
Power supply efficiency in dual magnetron large area sputter coating, Moritz Heintze*1), Jakub Swiatnicki2), 1) TRUMPF Huettinger GmbH + Co. KG, Germany, 2) TRUMPF Huettinger Sp. z o.o., Poland

Lunch Break 12:20-13:40

 

Sputtering Processes II (Cont'd)

13:40 SP2-7
Combinatorial magnetron sputtering for the discovery of new materials, Alfred Ludwig*, Institute for Materials, Faculty of Mechanical Engineering, Ruhr University Bochum, Germany (invited)
14:20 SP2-8
Synthesis of zirconium oxide thin films by reactive HiPIMS under peak current regulation, Tetsuhide Shimizu*1), Silmina Adzhani1), Nikolay Britun2), Adriano Panepinto2), Ming Yang1), Stephanos Konstantinidis2), 1) Graduate School of System Design, Tokyo Metropolitan University, Japan, 2) Plasma-Surface Interaction Chemistry, University of Mons, Belgium
14:40 SP2-9
On the corrosion performance of MgO thin films deposited by reactive HiPIMS under peak current regulation, Silmina Adzhani*1), Hidetoshi Komiya1), Yoshikazu Teranishi2), Ming Yang1), Tetsuhide Shimizu1), 1) Division of Intelligent Mechanical Systems, Graduate School of System Design, Tokyo Metropolitan University, Japan, 2) Surface Coating and Chemical Technology Group, Tokyo Metropolitan Industrial Technology Research Institute (TIRI), Japan

Coffee Break 15:00-15:20

 

Thin Films I

15:20 TF2-1
Multi-functionality of multi-component Zr-Cu-Ni-Al-N thin films for diffusion barrier, anti-bacteria and bio-compatibility, Jenq-Gong Duh*, National Tsing Hua University, Taiwan (invited)
16:00 TF2-2
Harlan™: high rate-high density pulsed magnetron sputtering source for depositing metal & ceramic coatings for industrial applications, Bassam abraham*, Roman Chistyakov, Ionex Corp, USA
16:20 TF2-3
Electrochemical hydrogen loading for internal stress control in maganetostrictive thin films, Kengo Yamaguchi*1), Masatoshi Inoue2), Ren Tokiwa2), Masato Kamiya3), Yoshihito Matsumura1), Helmut Takahiro Uchida2), 1) Course of Applied Science, Graduate School of Engineering, Tokai University, Japan, 2) Course of Mechanical Engineering, Graduate School of Engineering, Tokai University, Japan, 3) Dept. of Nuclear Engineering, School of Engineering, Tokai University, Japan
16:40 TF2-4
Origin of the spatial distribution of structural and electrical properties of transparent conductive Al-doped ZnO films deposited by magnetron sputtering, Junichi Nomoto*1), Tetsuo Tsuchiya1), Hisao Makino2), Tetsuya Yamamoto2), 1) Advanced Coating Technology Research Center, National Institute of Advanced Industrial Science and Technology (AIST), Japan, 2) Materials Design Center, Research Institute, Kochi University of Technology, Japan
17:00 TF2-5
Low-refractive-index optical thin films fabricated by simultaneous electron beam evaporation and sputtering, Mai Hayamizu*1), Yoshiki Tsuno1), Hiroshi Murotani1), Shigeharu Matsumoto2), 1) Tokai university, Japan, 2) Shincron CO.Ltd, Japan

Thursday 13 Poster Session 17:20-19:00

Fundamentals of Sputtering and Plasma, POSTER

FS2-1p
Gas pressure dependence on structural and electrical properties of Ni thin films on an acrylonitrile-butadiene-styrene resin prepared using unbalanced magnetron sputtering assisted by inductively coupled plasma, Masayuki Iwasaki*, Hiroshi Toyota, Hiroshima Institute of Technology, Japan
FS2-2p
A remote plasma spectroscopy based method for monitoring of volatile chemicals in a vacuum environment, Dermot Monaghan*, Joseph Brindley, Benoit Daniel, Victor Bellido, Gencoa Ltd, UK
FS2-3p
Effects of bombardment of argon ions backscattered at target surface in magnetron sputter deposition, Yasuhito Gotoh*, Shotaro Yano, Kyoto University, Japan
FS2-4p
Delayed discharge characteristics in modulated pulsed power magnetron sputtering of titanium, Hiroshi Nishida*1), Yoshihiro Hirai2,4), Yuki Nakagomi1), Nobuo Nishimiya1,2), Masaomi Sanekata2,3), Hiroaki Yamamoto4), Masahide Tona4), Keizo Tsukamoto4), Keijiro Ohshimo5), Fuminori Misaizu5), 1) Department of Electronics and Information Technology, Graduate school of Engineering, Tokyo Polytechnic University, Japan, 2) Department of Electronics and Mechatronics, Faculty of Engineering, Tokyo Polytechnic University, Japan, 3) General Education and Research Center, Faculty of Engineering, Tokyo Polytechnic University, Japan, 4) Ayabo Corporation, Japan, 5) Department of Chemistry, Graduate School of Science, Tohoku University, Japan
FS2-5p
RF power and gas pressure dependences on structural and electrical properties of Cu thin films on a glass substrate prepared using magnetron sputtering with multipolar magnetic plasma confinement, Taro Katayama*, Hiroshi Toyota, Hiroshima Institute of Technology, Japan

Plasma Processes, POSTER II

PP2-1p
Treatment of deteriorated cutting fluid by atmospheric-pressure plasma and in-liquid plasma, Junji Miyamoto*1), Ryo Tsuboi1), Shouhei Kawada2), Masashi Yoshida1), 1) Daido University, Japan, 2) Tokyo University of Science, Japan
PP2-2p
Hydrogen plasma treatment on compacted self-assembly graphene film as bottom electrode of resistive random access memory, Ya-Ting Chan*1), Lu-Yu1), Jer-Chyi Wang1,2,3), 1) Department of Electronic Engineering, Chang Gung University, Taiwan, 2) Department of Neurosurgery, Chang Gung Memorial Hospital, Taiwan, 3) Department of Electronic Engineering, Ming Chi University of Technology, Taiwan
PP2-3p
Effect of sample bias voltage on nitriding of tool steels in high electron density plasma, Kazuya Yamane*1), Junji Miyamoto1), Koichiro Nambu2), Masahiro Okumiya2), 1) Daido University, Japan, 2) Toyota Technological Institute, Japan

Thin Films, POSTER II

TF2-6p
Effect of nitrogen content and temperature on the microstructural and mechanical properties of CrN/CrAlSiN multilayer coatings prepared by high power impulse magnetron sputtering, Chun-Hong Huang*1), Chi-Lung Chang1,2), 1) Department of Materials Engineering, Ming Chi University of Technology, Taiwan, 2) Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan
TF2-7p
Work function and electronic structure measurements on nitrogen-doped LaB6 thin film prepared by RF sputtering deposition, Katsumi Nagaoka*1), Shun-ichiro Ohmi2), 1) National Institute for Materials Science, Japan, 2) Tokyo Institute of Technology, Japan
TF2-8p
Periodic multilayer film consisted of N-DLC and WC layers prepared by using filtered arc deposition and UBMS, Koki Tamekuni*1), Toru Harigai1), Tsuyoshi Tanimoto1), Yoshiyuki Suda1), Hirofumi Takikawa1), Shigeki Takago2), Haruyuki Yasui2), Satoru Kaneko3), Shinsuke Kunitsugu4), Masao Kamiya5), Makoto Taki6), 1) Toyohashi University of Technology, Japan, 2) Industrial Research Institute of Ishikawa, Japan, 3) Kanagawa Institute of Industrial Science and Technology, Japan, 4) Industrial Technology Center of Okayama Prefecture, Japan, 5) Itoh Optical Industrial Co., Ltd, Japan, 6) Onward Ceramic Coating Co., Ltd, Japan
TF2-9p
Phase transformation, structural characterization and dielectric properties of Nb doped zinc titanate thin films prepared by co-sputtering method, Du-Cheng Tsai*, Fuh-Sheng Shieu, National Chung Hsing University, Taiwan
TF2-10p
Electrical and optical properties of copper oxides thin films prepared by dc magnetron sputtering, Anmar Hassan*, Ichiro Takano, Kogakuin University, Japan,

Applications, POSTER I

AP2-1p
GZO-based multi-layer transparent conducting films, Chih-Yi Liu*1), Zhong-Jia Huang2), Shih-Kun Liu2), Yu-Jung Lin1), Chia-Hao Kung1), Meng-Ren Hsu1), 1) Department of Electronic Engineering, National Kaohsiung University of Science and Technology, Taiwan, 2) Institute of Photonics and Communications, National Kaohsiung University of Science and Technology, Taiwan
AP2-2p
Photocatalytic characteristics of Au/TiO2/Au nanostructure induced by ultraviolet irradiation, Retsuo Kawakami*1), Hirofumi Koide1), Yuki Yoshitani1), Shin-ichiro Yanagiya1), Toshihiro Okamoto1), Masanobu Haraguchi1), Akihiro Furube1), Masahito Niibe2), Yoshitaka Nakano3), Chisato Azuma1), Takashi Mukai4), 1) Tokushima University, Japan, 2) University of Hyogo, Japan, 3) Chubu University, Japan, 4) Nichia Corporation, Japan
AP2-3p
Bipolar resistive switching of Ag-doped NiO-based RRAM devices, Hsien-Heng Tang*, Thou-Jen Whang, Yan-Kuin Su, National Cheng-Kung University, Taiwan

Friday 14 Oral Session

Micro and Nano Technologies / Plasma Induced Process Technologies

09:00 KN-3
Novel atmospheric plasma systems and applications, Ladislav Bardos*1,2), Hana Barankova1,2), 1) Uppsala University, Angstrom Laboratory, Plasma Group, Sweden, 2) BB Plasma Design AB, Sweden (KEYNOTE)
09:40 MN3-1
Sputtering metals on liquid substrates for nanoparticle synthesis., Stephanos Konstantinidis*1), Xavier Carette1,2), Benoît Debièvre1), David Cornil3), Jérôme Cornil3), Philippe Leclère3), Nicolas Gautier4), Eric Gautron4), Abdel Azziz El Mel4), Jean-Marie Raquez2), 1) University of Mons, Plasma - Surface Interaction Chemistry, Belgium, 2) University of Mons, Laboratory of Polymeric and Composite Materials, Belgium, 3) University of Mons, Chemistry of Novel Materials, Belgium, 4) Institute of Materials Jean Rouxel, IMN Université de Nantes, France
10:00 PI3-1
Reactive deposition of TiN by magnetron with magnetized hollow cathode enhanced target, Hana Barankova*1,2), Ladislav Bardos1,2), 1) Uppsala University, Angstrom Laboratory, Plasma Group, Sweden, 2) BB Plasma Design AB, Sweden
10:20 PI3-2
Polymerization and surface modification process to improvement the adhesion of plastic substrates, Kuan-Wei Lu*1), Yu-Tian Lin1), Wei-Bo Liao1), Chien-Cheng Kuo1,2), 1) Department of Optics and Photonics, National Central University, Taiwan, 2) Thin Film Technology Center, National Central University, Taiwan

Coffee Break 10:40-11:00

 

Thin Films II

11:00 TF3-1
Study of interaction between plasmons in nanocavities and excitons in two dimensional materials, B K Tay*1,2), Z Liu3), X L Wang1), L L Shiau1), 1) NOVITAS, School of EEE, Nanyang Technological University, Singapore, 2) CINTRA UMI CNRS/NTU/THALES 3288, Singapore, 3) School of MSE, Nanyang Technological University, Singapore (invited)
11:40 TF3-2
Reactive deep oscillation magnetron sputtering of Al-O-N films with tunable composition and properties, Jaroslav Vlcek*, Alexandr Belosludtsev, Jiri Houska, Stanislav Haviar, Radomir Cerstvy, University of West Bohemia, Czech Republic
12:00 TF3-3
The role of residual impurities on optical properties of sputtered (Ti,Al)N coatings, Jana Bohovicova1,2), Marcel Mesko*1,2), Alvaro Mendez3), Jaakko Julin2), Frans Munnik2), Joerg Grenzer2), Lubomir Caplovic1), Matthias Krause2), 1) Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Slovakia, 2) Helmholtz-Zentrum Dresden-Rossendorf, Institute of Ion Beam Physics and Materials Research, Germany, 3) Nano4Energy SLNE, IFN, Escuela Tecnica Superior de Ingenieros Industriales, Spain
12:20 TF3-4
Two-dimensional hBN layer promoted heteroepitaxy in sputter-deposited Ta2C(0001)/Al2O3(0001) thin films, Koichi Tanaka*, Pedro Arias, Michael E. Liao, Yekan Wang, Hicham Zaid, Angel Aleman, Mark S. Goorsky, Suneel Kodambaka, Department of Materials Science and Engineering, University of California, USA

Lunch Break 12:40-14:00

 

Applications

14:00 AP3-1
Multi-component and high-entropy nitride coatings – synthesis, characterisation, and open questions, Erik Lewin*, Uppsala university, Sweden (invited)
14:40 AP3-2
HiPIMS is the future of cutting tool coatings, Alexander Marxer*1), Toni Leyendecker2), Christoph Schiffers2), 1) CemeCon K.K., Japan, 2) CemeCon AG, Germany
15:00 AP3-3
Electrochromic properties of sputter-deposited rhodium oxide thin films with various film thicknesses, Chan Yang Jeong*, Yoshio Abe, Midori Kawamura, Kyung Ho Kim, Takayuki Kiba, Kitami Institute of Technology, Japan

Friday 14 Poster Session 15:20-16:40

Sputtering Processes, POSTER II

SP3-1p
Spatial distribution diagnosis of plasma by emission spectroscopy in DLC films formation using bipolar HiPIMS method, Hiroyuki Fukue*1), Yuga Koyama2), Tadayuki Okano3), Masahide Kuroiwa3), Shinsuke Kunitsugu4), Tatsuyuki Nakatani5), 1) Graduate School of Engineering, Okayama University of Science, Japan, 2) Faculty of Engineering, Okayama University of Science, Japan, 3) Tokyo Electronics Co., Ltd., Japan, 4) Industrial Technology Center of Okayama Prefecture, Japan, 5) Research Institute of Technology, Okayama University of Science, Japan
SP3-2p
Molybdenum deposition on glass substrate by high power pulsed unbalanced magnetron discharge in argon/nitrogen mixture gas, Kingo Azuma*1), Yoshihiro Oka1), Takashi Kimura2), Setsuo Nakao3), 1) University of Hyogo, Japan, 2) Nagoya Institute of Technology, Japan, 3) Advanced Industrial Science and Technology, Japan
SP3-3p
Deposition of Si-doped DLC films using by reactive HiPIMS combined with PBII system, Takashi Kimura*1), Yuki Shibata1), Setsuo Nakao2), Kingo Azuma3), 1) Graduate School of Engineering, Nagoya Institute of Technology, Japan, 2) Chubu Center, Advanced Industrial Science and Technology, Japan, 3) Graduate School of Engineering, University of Hyogo, Japan

Plasma Induced Process Technologies, POSTER

PI3-3p
Tailoring the surface hardness of SKD11 die steel by atmospheric pressure plasma jet, Wan-Ting Zhong*1), Shang-Bin Dong1), Jhao-Yu Guo1), Hsien-Po Wang1,2), Yu-Lin Kuo1), Yao-Ming Wang3), 1) Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taiwan, 2) Click Sun Shine Corp., Taiwan, 3) Industrial Upgrading Service Department, Metal Industries Research & Development Centre, Taiwan
PI3-4p
Study of atmospheric pressure glow discharge electrolysis for the recovery treatment of silver-containing solution, Yu-Lin Kuo1), Shang-Yuan Chung*1), Kuen-Yu Tsai1), Sagung Dewi Kencana1), Yao-Ming Wang2), 1) Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taiwan, 2) Industrial Upgrading Service Department, Metal Industries Research & Development Centre, Taiwan

Thin Films, POSTER III

TF3-5p
Residual stress measurement of {211} oriented CrN layers in Cr/CrN multilayered films, Kazuya Kusaka*1), Kenta Shirasaka2), Daisuke Yonekura1), Yuta Tanaka3), 1) Tokushima University, Japan, 2) Graduate student of Tokushima University, Japan, 3) IHI Corporation, Japan
TF3-6p
Thermal Stability of Multilayered Ru–Si–Zr Coatings on Inconel 617, Yung-I Chen, Hsien-Hao, Lo*, National Taiwan Ocean University, Taiwan
TF3-7p
Effect of deposition condition on the crystal phase of 18-8 stainless steel films prepared by dc magnetron sputtering, Shozo Inoue*, Yu Fujiwara, Najami Zahira, Naoki Umada, Department of Mechanical Engineering, University of Hyogo, Japan
TF3-8p
Anomalous growth of isolated nanocolumns in glancing-angle reactive sputtering, Sho Akiyama1), Masashi Hosoya1), Yasushi Inoue*1), Osamu Takai2), 1) Chiba Institute of Technology, Japan, 2) Kanto-gakuin University, Japan
TF3-9p
Effect of post-annealing on the resistivity of Al-doped ZnO films prepared by rf magnetron sputtering, Toshiki Suwa*, Imaizumi Satoru, Tadashi Nakamura, Kunio Okimura, Graduate school of engineering, Tokai University, Japan
TF3-10p
Effect of TiO2 interlayer in PZT thin film for improving crystal growth, Noriaki Ikenaga, Yuki Hoshino*, Naoki Osawa, Department of Electrical and Electronic Engineering, Kanazawa Institute of Technology, Japan

Applications, POSTER II

AP3-4p
Write-once-read-many-times behaviors of ITO-based structures, Chih-Yi Liu*, Chia-Hao Kung, You-Chi Wang, Yu-Jung Lin, Department of Electronic Engineering, National Kaohsiung University of Science and Technology, Taiwan
AP3-5p
In-plane stress impact on the thermodynamic properties in metal-hydrogen systems and its application, Ren Tokiwa*1), Hironori Odaka1), Kengo Yamaguchi2), Masatoshi Inoue1), Yoshihito Matsumura2), Helmut Takahiro Uchida1), 1) Course of Mechanical Engineering, Graduate School of Engineering, Tokai University, Japan, 2) Course of Applied Science, Graduate School of Engineering, Tokai University, Japan
AP3-6p
Experimental study on the sputtering process for vanadium oxides films, Chuan Li1), J. H. Hsieh2), C. M. Su*1), 1) National Yang Ming University, Taiwan, 2) Ming Chi University of Technology, Taiwan
AP3-7p
Development of air dielectric barrier discharge with rotatable electrodes for bacteria inactivation of powder, Naw Rutha Paw*, Kentaro Morimoto, Tatsuo Ishijima, Yasunori Tanaka, Yoshihiko Uesugi, Faculty of Electrical and Computer Engineering, Kanazawa University, Japan
AP3-8p
Cytocompatibility of titanium oxide thin films deposited by reactive sputtering, Aoi Nishijima*1), Kei Oya1), Takeo Nakano1), Yoshihide Hashimoto2), Seiichi Funamoto2,3), Akio Kishida2), 1) Faculty of Science and Technology, Seikei University, Japan, 2) Institute of Biomaterials and Bioengineering, Tokyo Medical and Dental University, Japan, 3) International Center for Materials Nanoarchitectonics, National Institute for Materials Science, Japan

Closing Remarks 16:40-17:00

16:40
Poster Award Ceremony
16:50
Closing Remark